Plastic type CF

• PA66/CF30 polyamide 66 reinforced with 30 wt% carbon fibre.
• Heat stabilized.
• Very high rigidity, excellent tensile and flexural strength, fatigue and creep resistance.
• Low friction, self lubricating properties, excellent wear and abrasion resistance.
• Good heat capability.
• Good chemical resistance (oils, grease, fuels, non-polar solvents); not resistant to strong acids, alkalis and hot water or steam.
• ESD safe material, (avoid powder attraction, sparks generation, ignition sources).
• Very low coefficient of linear thermal expansion.
• Typical applications include handling of sensitive components and devices (electronic components, micro-mechanical parts, glass and ceramic substrates, capillary, etc.).

Plastic type DG

• POM/GF30 acetal resin reinforced with 30 wt% glass fibre.
• Good tensile and flexural strength, fatigue and creep resistance.
• Low friction, good wear and abrasion resistance.
• Good chemical resistance (oils, grease, fuels, organic solvents); not resistant to strong acids, alkalisand oxidizing agents; good hydrolytic resistance (hot water).
• Insulating.
• Typical applications include handling of very scratch sensitive components (ceramic and glass devices, wafers, capillary).

Plastic type SV

• PVDF polyvinylidene fluoride carbon fibre reinforced.
• Excellent mechanical strength and toughness.
• Smooth surface.
• Heat stabilized, high heat capability, continuous use temperature up to 150°C.
• High purity (clean room and medical devices approved, low extraction value).
• Excellent chemical resistance to most aggressive substances (mineral and organic acid) and solvents (hydrocarbons, alcohols, halogenated), resistant to halogens.
• Outstanding resistance to hydrofluoric acid (40% conc., 90°C), nitric acid (50% conc., 90°C), hydrochloric acid (36% conc., 90°C).
• High abrasion resistant.
• Resistant to UV and nuclear radiation (sterilisation).
• ESD safe material, (avoid powder attraction, sparks generation, ignition sources).
• Typical applications include handling of very scratch-and contamination-sensitive components, cleaning and etching processes.